Impact of via hole integration on multijunction solar cells for through cell via contacts and associated passivation treatment
M de Lafontaine, M Darnon, C Colin… - IEEE Journal of …, 2017 - ieeexplore.ieee.org
The impact of via etching on triple junction solar cell performance has been investigated for
through cell via contact architectures. Triple junction solar cells with standard top and back …
through cell via contact architectures. Triple junction solar cells with standard top and back …
Plasma etching applications in concentrated photovoltaic cell fabrication
Photovoltaic cells are conventionally electrically isolated (isolation) and then separated from
the wafer (singulation) by saw dicing at the end of the fabrication process. However, saw …
the wafer (singulation) by saw dicing at the end of the fabrication process. However, saw …
Via sidewall insulation for through cell via contacts
Over the past few years, through cell via contacts (TCVC) architecture has been the object of
a growing interest to replace standard front side and backside contact on concentrated …
a growing interest to replace standard front side and backside contact on concentrated …
Two-step hole etching process
W Koestler - US Patent 11,063,170, 2021 - Google Patents
(57) ABSTRACT A two-step hole etching method including: providing a semiconductor wafer
which has a plurality of solar cell stacks and performing a first and a second processing step …
which has a plurality of solar cell stacks and performing a first and a second processing step …