The continuous improvement of electronic device performances and the advancement of
packaging technology have brought greater challenges to the reliability of solder joints in …

With the implementation of legislations on inhibiting the usage of Sn–Pb solder in consumer
electronic products, Sn–Ag–Cu series solder has been gotten the most application …

Introducing foreign reinforcements into solder joints has been demonstrated to be beneficial
to promoting the soldering reliability. In this work, Ni-decorated reduced graphene oxide (Ni …

As temperature cycling drives fatigue failure of solder joints in electronic modules,
characterisation of the thermal fatigue response of different solder alloy formulations in BGA …

As to promote the performance of the solder joints applied to electronics industry, the
researchers take advantage of micro/nano-sized particles or another element coated on …

During the past decades, series of lead-free solders have been developed rapidly, and are
considered as the attractive interconnection materials replacing traditional Sn-Pb solders in …

Sn-based lead-free solders such as Sn-Ag-Cu, Sn-Cu, and Sn-Bi have been used
extensively for a long time in the electronic packaging field. Recently, low-temperature Sn-Bi …

This study reviews the existing research on the effects of surface roughness on the
wettability and intermetallic compound (IMC) layer formation in lead-free solder joints. The …

Due to the advantages of small form factor, high performance, low power consumption, and
high density integration, three-dimensional integrated circuits (3D ICs) have been generally …

The IMC (interfacial intermetallic compound) produced by the metallurgical reaction
between the solder and the Cu plate enables the packaging of IGBT (insulated gate bipolar …