Humans rely increasingly on sensors to address grand challenges and to improve quality of
life in the era of digitalization and big data. For ubiquitous sensing, flexible sensors are …

In the past decade, monolithic three dimensional integrated circuits (M3D-ICs) advance fast
and demonstrate several important breakthroughs in the fabrication process and circuit level …

Semiconducting carbon nanotube (CNT) film is a promising material for constructing high-
performance complementary metal-oxide-semiconductor (CMOS) integrated circuits (ICs) …

Carbon nanotube field‐effect transistors (CNT FETs) have been demonstrated to exhibit
high performance only through low‐temperature fabrication process and require a low …

In this paper, first, a broad overview of existing covert channel communication-based
security attacks is provided. Such covert channels establish a communication link between …

The semiconductor industry is transitioning to the 'More Moore'era, driven by the adoption of
three-dimensional (3D) integration schemes surpassing the limitations of traditional two …

In the dynamic landscape of Artificial Intelligence (AI), two notable phenomena are
becoming predominant: the exponential growth of large AI model sizes and the explosion of …

Energy efficiency in digital systems faces challenges due to the constraints imposed by
small-scale transistors. Moreover, the growing demand for portable consumer electronics …

Monolithic 3-D (MONO3 D) integration provides performance and power efficiency benefits
over 2-D circuits and, thus, is a potent technology for the design of deep neural network …

Exploiting thermal coupling among the cores of a processor to secretly communicate
sensitive information is a serious threat in mobile, desktop, and server platforms. Existing …