This paper presents buckled nitride thin-film encapsulation using anti-adhesion layer-
assisted transfer technique and benzocyclobutene (BCB)/nitride bilayer wrinkling due to …

The BAW (Bulk acoustic Wave) RF filters that are used in mobile phone application are
composed of pair of piezo electrical resonators which need an air gap above them to …

The multi-billion-dollar microsystem packaging business continues to play an increasingly
important technical role in today's information industry. The packaging process—including …

This paper presents a novel wafer-level thin-film encapsulation process that allows both
narrow and wide trenches, which are necessary for traditional structures such as …

Thin-film encapsulation (TFE) is one of the promising wafer-level packaging techniques for
microelectromechanical systems (MEMS) devices. One of the drawbacks of TFE is that it is …

A method of forming an electromechanical power switch for controlling power to integrated
circuit (IC) devices and related devices. At least some of the illustrative embodiments are …

the present invention generally relates to semiconductor devices. More particularly, the
present invention relates to the integration of micro-electromechanical systems (MEMS) or …

In this paper, a summary of the most relevant failure mechanisms of thin-film vacuum
microelectromechanical systems (MEMS) packages and existing testing techniques will be …

This paper presents a 3D direct numerical simulation of buckled thin-film packaging based
on transferred elastic thin-film wrinkling bonded on a compliant polymer ring. The mode …

Because they have moving parts, and they need to work in a specific atmosphere (vacuum,
inert gas...), micro-electromechanical system (MEMS) are not compatible with integrated …