(57) ABSTRACT A display system is disclosed. The display system comprises a light
emitting diode (LED) device and a backplane (BP) device. The LED device comprises a …

2019-06-14 Assigned to INTEL CORPORATION reassignment INTEL CORPORATION
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors …

A color stacked light emitting diode (LED) pixel is disclosed. The color stacked LED includes
an LED pixel structure body, a base LED disposed on at least a portion of the LED pixel …

Isolated complementary metal-oxide semiconductor (CMOS) devices for radio-frequency
(RF) circuits are dis closed. In some aspects, an RF circuit includes CMOS devices, a silicon …

A semiconductor device including a via plug formed on a substrate and a metal layer for
interconnection formed at an end of the via plug, wherein an insulating structure is under the …

A radio frequency (RF) front-end (RFFE) device includes a die having a front-side dielectric
layer on an active device. The active device is on a first substrate. The RFFE device also …

(57) ABSTRACT A chip package structure including a redistribution structure layer, at least
one chip, and an encapsulant is provided. The redistribution structure layer includes at least …

Various embodiments of the present disclosure are directed towards a three-dimensional
(3D) trench capacitor, as well as methods for forming the same. In some embodiments, a first …

In one general aspect, an integrated passive device (IPD) die includes at least one passive
component that is embedded in an insulator material disposed on a front surface of a …

Disclosed is a device which includes first and second major substrate surfaces. The first
substrate surface includes an LED with first and second terminals while the second …