Metal–organic frameworks (MOFs) offer disruptive potential in micro-and optoelectronics
because of the unique properties of these microporous materials. Nanoscale patterning is a …

This paper presents an overview and perspective on processing technologies required for
continued scaling of leading edge and emerging semiconductor devices. We introduce the …

The performance of modern chips is strongly related to the multi-layer interconnect structure
that interfaces the semiconductor layer with the outside world. The resulting demand to …

Ordered mesoporous oxides obtained by combining sol-gel and self-assembly exhibit high
surface area, controlled porosity, monodisperse pores in the mesoscale and amorphous or …

Significant progress has been made in integrating novel materials into silicon photonic
structures in order to extend the functionality of photonic circuits. One of these promising …

An increase in resistance and capacitance (RC) delay has been a critical issue in reducing
integrated circuit scales. The delay is successfully reduced using low dielectric constant (κ) …

A new functional monomer with crosslinkable allyl and benzocyclobutene (BCB) units has
been successfully synthesized through a facile procedure. Based on this monomer, a low …

This paper presents an in-depth overview of the application and impact of UV/VUV light in
advanced interconnect technology. UV light application in BEOL historically was mainly …

Critical properties of porous periodic mesoporous silica (PMO) low-k dielectric with a
different ratio of benzene bridges and methyl terminal groups are studied by using various …

Characterization of mechanical properties of thin porous films with nanoscale resolution
remains a challenge for instrumentation science. In this work, atomic force microscopy (AFM) …