M Nagata, T Miki, N Miura - IEEE transactions on very large …, 2021 - ieeexplore.ieee.org
Secure hardware systems are threatened by adversarial attempts on integrated circuit (IC) chips in a practical utilization environment. This article provides overviews of physical …
An integrated circuit is subject to a number of attacks including information leakage, side- channel attacks, fault-injection, malicious change, reverse engineering, and piracy. Majority …
L Lin, D Zhu, J Wen, H Chen, Y Lu… - … Security and Trust …, 2021 - ieeexplore.ieee.org
The silicon substrate backside of modern ICs is increasingly recognized as a critical hardware vulnerability, which opens a backdoor for laser/optical probing, fault injection and …
T Wadatsumi, T Miki, M Nagata - Japanese Journal of Applied …, 2021 - iopscience.iop.org
An on-chip noise monitor using a dual-mode analog to digital converter (ADC) is developed to detect the insertion of off-chip components as malicious attempts of power noise …
B Selmke, M Pollanka, A Duensing… - IACR Transactions on …, 2022 - tches.iacr.org
Abstract Laser Fault Injection (LFI) is considered to be the most powerful semiinvasive fault injection method for implementation attacks on security devices. In this work we discuss for …
T Wadatsumi, K Kawai, R Hasegawa… - 2022 IEEE …, 2022 - ieeexplore.ieee.org
Voltage surges induced by electrostatic discharge (ESD) impacts on the backside of an integrated circuit (IC) chip in flip-chip packaging potentially causes reliability problems and …
T Wadatsumi, K Kawai, R Hasegawa… - 2023 IEEE …, 2023 - ieeexplore.ieee.org
Si-substrate backside of an integrated circuit (IC) chip becomes an open surface for electrostatic discharge (ESD) impacts in flip-chip assembly. This paper proposes an …
Y Gao, Q Zhang, X Song, H Ma, J He… - IEEE Transactions on …, 2024 - ieeexplore.ieee.org
Smart devices, especially Internet-connected devices, typically incorporate security protocols and cryptographic algorithms to ensure the control flow integrity and information …