The compelling demand for higher performance and lower power consumption in electronic
systems is the main driving force of the electronics industry's quest for devices and/or …

In an effort to increase processor speeds, 3D IC architecture is being aggressively pursued
by researchers and chip manufacturers. This architecture allows extremely high level of …

Twenty-first century opportunities for GSI will be governed in part by a hierarchy of physical
limits on interconnects whose levels are codified as fundamental, material, device, circuit …

Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more
than twice as much new content, adding the latest developments in circuit models …

Laser Annealing of Semiconductors deals with the materials science of surfaces that have
been subjected to ultrafast heating by intense laser or electron beams. This book is …

Amorphous and microcrystalline silicon carbide, undoped and doped, has attracted a great
attention for its optical and electrical properties. The introduction of dopant atoms in the …

Design techniques for three-dimensional (3-D) ICs considerably lag the significant strides
achieved in 3-D manufacturing technologies. Advanced design methodologies for two …

Present-day scienceand technology have become increasingly based on studies and
applications of thin films. This is especiallytrue of solid-state physics, semiconduc tor …

A theory of conduction in polycrystalline silicon is presented. The present approach
fundamentally differs from previous theories in its treatment of the grain boundary. This …

A CMOS inverter having a single gate for both n and p channel devices has been fabricated
using bulk silicon for the p channel device and a laser-recrystallized silicon film for the n …