High-bandwidth memory (HBM) offers breakthrough memory bandwidth through its vertically
stacked memory architecture and through-silicon via (TSV)-based fast interconnect …

3D-stacked processor-memory systems stack memory (DRAM banks) directly on top of logic
(CPU cores) using chiplet-on-chiplet packaging technology to provide the next-level …

In this brief, a new distributed thermal management scheme using task migrations based on
a new temperature metric called effective initial temperature is proposed to reduce the on …

The inherent advantages of three-dimensional (3-D) integrated circuits (ICs) are well-
aligned with the continuous demand for increased density of functionality, reduced latency …

The need for full-chip dynamic thermal simulation for effective runtime thermal management
of multicore processors has been growing in recent years due to the rising demand for high …

Exploiting thermal coupling among the cores of a processor to secretly communicate
sensitive information is a serious threat in mobile, desktop, and server platforms. Existing …

Ubiquitous in today's consumer-driven society, embedded systems use microprocessors that
are hidden in our everyday products and designed to perform specific tasks. Effective use of …

In this paper, we introduce voltage-frequency island (VFI)-based design paradigm into three
dimensional (3-D) network-on-chip (NoC) to optimize system energy. The prominent …

The confluence of 3-D integration and network-on-chip (NoC) provides an effective solution
to the scalability problem of on-chip interconnects. In 3-D integration, through-silicon via …

Due to increased demands for communication at low power, an efficient application
mapping has become vital in the area of network on chip (NoC). Optimisation of architectural …