US PATENT DOCUMENTS 2,821,959 A 2, 1958 Franz 3,006,318 A 10/1961 Monroe, Jr. et
al. 3,345,134 A 10/1967 Heymer et al. 3,865,298 A 2f1975 Allen et al. 3,902,036 A 8, 1975 …

Microelectronic devices and methods for filling vias and forming conductive interconnects in
microfeature workpieces and dies are disclosed herein. In one embodiment, a method …

Conductive interconnect structures and formation methods using Supercritical fluids are
disclosed. A method in accor dance with one embodiment of the invention includes form ing …

Imprinting an identification indicia on a cartridge in a difficult context, such as on a coated
cartridge or on a high power cartridge. A marking indicia is formed on a base surface located …

Microelectronic devices, methods for packaging microelec tronic devices, and methods for
forming vias and conductive interconnects in microfeature workpieces and dies are dis …

Microfeature workpieces having conductive vias formed by chemically reactive processes,
and associated systems and methods are disclosed. A method in accordance with one …

(57) ABSTRACT A through-wafer interconnect for imager, memory and other integrated
circuit applications is disclosed, thereby eliminat ing the need for wire bonding, making …

Methods for forming interconnects in microfeature work pieces, and microfeature workpieces
having such intercon nects are disclosed herein. The microfeature workpieces may have a …

In brief, the object of the present invention is to provide firearm manufacturers with a solution
for recovering, Sorting, marking, and acquiring the images of spent cartridge cases during …

Methods for forming interconnects in blind vias or other types of holes, and microelectronic
workpieces having Such interconnects. The blind vias can beformed by first removing the …