Low-temperature plasma-processing technologies are essential for material synthesis and
device fabrication. Not only the utilization but also the development of plasma-related …

In this paper, the emerging role of ionic species in plasma assisted chemical deposition
processes is discussed in detail for commemorating the Career of John Coburn, who studied …

Benzocyclobutene (BCB) resin has been widely used as an advanced electronic packaging
material due to its excellent low-dielectric (low-k) properties, good thermal stability, and high …

In the area of Polymer dielectric materials, those with low dielectric constant and low
dielectric loss have potential to be applied in high-frequency signal transmissions, such as …

Polymer materials with a low dielectric constant and low dielectric loss have the potential to
be applied to high-frequency signal transmissions, such as mobile phone antennas and …

Surfactant-templated porous organosilicate glass low-k films have been deposited by using
a tetraethoxysilane (TEOS) and methyltriethoxysilane (MTEOS) mixture with different ratios …

Polyimide (PI) faces new challenges in meeting the requirements of low coefficient of
thermal expansion (CTE), low dielectric content/loss, and high thermal stability to be utilized …

Flexible low-dielectric constant (low-k, k< 4.0) SiCOH films were deposited onto ITO/PEN
flexible substrates by plasma-enhanced chemical vapor deposition of tetrakis …

The Overview of Current Interconnect Technology Challenges and Future Opportunities Page
1 The Overview of Current Interconnect Technology Challenges and Future Opportunities MH …

We investigated the adsorption properties and the dielectric behavior of a very well-known
metal-organic framework (MOF), namely Cu3 (BTC) 2 (known as HKUST-1; BTC= 1, 3, 5 …