Anisotropy of hardness and impression morphology in body-centered tetragonal tin (Sn) at cryogenic temperature and room temperature
X Ji, R An, W Zhou, Y Xia, F Guo, C Wang - Journal of Materials Science …, 2023 - Springer
Tin (Sn), as the matrix of most lead-free solders, plays a primary role in stress absorption
during the service of small-scale solder joints under cryogenic environment. The Sn grain …
during the service of small-scale solder joints under cryogenic environment. The Sn grain …
Anisotropy of hardness and impression morphology in body-centered tetragonal tin (Sn) at cryogenic temperature and room temperature.
X Ji, R An, W Zhou, Y Xia, F Guo… - Journal of Materials …, 2023 - search.ebscohost.com
Tin (Sn), as the matrix of most lead-free solders, plays a primary role in stress absorption
during the service of small-scale solder joints under cryogenic environment. The Sn grain …
during the service of small-scale solder joints under cryogenic environment. The Sn grain …
Anisotropy of hardness and impression morphology in body-centered tetragonal tin (Sn) at cryogenic temperature and room temperature
X Ji, R An, W Zhou, Y Xia, F Guo… - Journal of Materials …, 2023 - search.proquest.com
Tin (Sn), as the matrix of most lead-free solders, plays a primary role in stress absorption
during the service of small-scale solder joints under cryogenic environment. The Sn grain …
during the service of small-scale solder joints under cryogenic environment. The Sn grain …