Atomic layer etch methods and hardware for patterning applications

P Agarwal, P Kumar, A Lavoie - US Patent 9,997,371, 2018 - Google Patents
Methods and apparatuses for patterning carbon-containing material over a layer to be
etched are provided herein. Methods involve trimming carbon-containing material by atomic …
被引用次数：32 相关文章

Atomic layer etch methods and hardware for patterning applications

P Agarwal, P Kumar, A Lavoie - US Patent 9,997,371, 2018 - freepatentsonline.com
Methods and apparatuses for patterning carbon-containing material over a layer to be
etched are provided herein. Methods involve trimming carbon-containing material by atomic …