Impact of low-k structure and porosity on etch processes
The fabrication of interconnects in integrated circuits requires the use of porous low
dielectric constant materials that are unfortunately very sensitive to plasma processes. In this …
dielectric constant materials that are unfortunately very sensitive to plasma processes. In this …
[引用][C] Impact of low-k structure and porosity on etch processes
M Darnon, N Casiez, T Chevolleau, G Dubois… - Journal of Vacuum …, 2013 - hal.science
Impact of low-k structure and porosity on etch processes - Archive ouverte HAL Accéder
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[引用][C] Impact of low-k structure and porosity on etch processes
M Darnon, N Casiez, T Chevolleau… - Journal of Vacuum …, 2013 - ui.adsabs.harvard.edu
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[引用][C] Impact of low-k structure and porosity on etch processes
M Darnon, N Casiez, T Chevolleau… - Journal of Vacuum …, 2013 - hal.univ-grenoble-alpes.fr
Impact of low-k structure and porosity on etch processes - Université Grenoble Alpes Accéder
directement au contenu Documentation FR Se connecter Portail HAL UGA Recherche …
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Impact of low-k structure and porosity on etch processes
M Darnon, N Casiez, T Chevolleau, G Dubois… - Journal of Vacuum …, 2013 - pubs.aip.org
The fabrication of interconnects in integrated circuits requires the use of porous low
dielectric constant materials that are unfortunately very sensitive to plasma processes. In this …
dielectric constant materials that are unfortunately very sensitive to plasma processes. In this …
Impact of low-k structure and porosity on etch processes
M Darnon, N Casiez, T Chevolleau… - Journal of Vacuum …, 2012 - research.ibm.com
The fabrication of interconnects in integrated circuits requires the use of porous low
dielectric constant materials that are unfortunately very sensitive to plasma processes. In this …
dielectric constant materials that are unfortunately very sensitive to plasma processes. In this …
[引用][C] Impact of low-k structure and porosity on etch processes
M Darnon, N Casiez, T Chevolleau… - Journal of Vacuum …, 2013 - hal.univ-grenoble-alpes.fr
Impact of low-k structure and porosity on etch processes - Université Grenoble Alpes Accéder
directement au contenu Documentation FR Se connecter Portail HAL UGA Recherche …
directement au contenu Documentation FR Se connecter Portail HAL UGA Recherche …