Adaptive Inspection for Void Defects Inside Solder Joints of Chip Resistors

N CAI, M XIAO, P XIAO, S ZHOU, B QIU, H WANG - 电子与信息学报, 2022 - jeit.ac.cn
In the process of reflow soldering, void defects inevitably emerge inside solder joints of chip
resistors, which will influence reliability of the device. In this paper, an adaptive inspection …
被引用次数：1 相关文章

Adaptive Inspection for Void Defects Inside Solder Joints of Chip Resistors

CAI Nian, X Meng, X Pan, Z Shuai, QIU Baojun, W Han - 电子与信息学报, 2022 - jeit.ac.cn
In the process of reflow soldering, void defects inevitably emerge inside solder joints of chip
resistors, which will influence reliability of the device. In this paper, an adaptive inspection …