Optimization of Cu interconnects-SiCN interfacial adhesion by surface treatments
This paper deals with the interfacial reliability between Cu interconnects and dielectric
materials which is a major obstacle to improving the manufacturing yield of memory devices …
materials which is a major obstacle to improving the manufacturing yield of memory devices …
Optimization of Cu interconnects-SiCN interfacial adhesion by surface treatments
DJ Kim, S Kang, SW Lee, I Lee, S Park… - 73rd IEEE Electronic …, 2023 - pure.kaist.ac.kr
This paper deals with the interfacial reliability between Cu interconnects and dielectric
materials which is a major obstacle to improving the manufacturing yield of memory devices …
materials which is a major obstacle to improving the manufacturing yield of memory devices …
Optimization of Cu interconnects-SiCN interfacial adhesion by surface treatments
DJ Kim, S Kang, SW Lee, I Lee, S Park… - 73rd IEEE Electronic …, 2023 - koasas.kaist.ac.kr
This paper deals with the interfacial reliability between Cu interconnects and dielectric
materials which is a major obstacle to improving the manufacturing yield of memory devices …
materials which is a major obstacle to improving the manufacturing yield of memory devices …
[引用][C] Optimization of Cu Interconnects-SiCN Interfacial Adhesion by Surface Treatments
DJ Kim, S Kang, SW Lee, I Lee, S Park… - The 19th …, 2021 - koasas.kaist.ac.kr
DSpace at KOASAS: Optimization of Cu Interconnects - SiCN Interfacial Adhesion by Surface
Treatments KOASAS menu About KOASAS KAIST Library 검색 Advanced Search KOASAS …
Treatments KOASAS menu About KOASAS KAIST Library 검색 Advanced Search KOASAS …