Recent advanced thermal interfacial materials: A review of conducting mechanisms and parameters of carbon materials

Y Zhang, YJ Heo, YR Son, I In, KH An, BJ Kim, SJ Park - Carbon, 2019 - Elsevier
Rapid developments of integrated circuits in electronics, aerospace, and aeronautics are
always accompanied with the issue of heat diffusion, which impacts service efficiency and …
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[引用][C] Recent advanced thermal interfacial materials: A review of conducting mechanisms and parameters of carbon materials

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