High power laser packaging challenges and standardization

E Zhou, J Morris, H Wang - 2014 IEEE 64th Electronic …, 2014 - ieeexplore.ieee.org
The initial study of the electromagnetic acoustic resonance effect in high power
semiconductor laser packages is reported here, along with the first detailed investigation on …
被引用次数：1 相关文章

High power laser packaging challenges and standardization

E Zhou, J Morris, H Wang - 2014 IEEE 64th Electronic Components and … - infona.pl
The initial study of the electromagnetic acoustic resonance effect in high power
semiconductor laser packages is reported here, along with the first detailed investigation on …