Optoelectronic ball grid array package with fiber
C Doerr - US Patent 11,360,278, 2022 - Google Patents
A photonic integrated circuit may be coupled to an optical fiber and packaged. The optical
fiber may be supported by a fiber holder during a solder reflow process performed to mount …
fiber may be supported by a fiber holder during a solder reflow process performed to mount …
Optoelectronic ball grid array package with fiber
C Doerr - US Patent 11,360,278, 2022 - freepatentsonline.com
A photonic integrated circuit may be coupled to an optical fiber and packaged. The optical
fiber may be supported by a fiber holder during a solder reflow process performed to mount …
fiber may be supported by a fiber holder during a solder reflow process performed to mount …
Optoelectronic ball grid array package with fiber
C Doerr - US Patent App. 14/927,016, 2016 - Google Patents
0004 2. Related Art 0005 Photonic integrated circuits (PICs) include optical components
fabricated on a silicon Substrate. Often an optical fiber is coupled to the PIC to deliver optic …
fabricated on a silicon Substrate. Often an optical fiber is coupled to the PIC to deliver optic …
OPTOELECTRONIC BALL GRID ARRAY PACKAGE WITH FIBER
C Doerr - US Patent App. 14/927,016, 2016 - freepatentsonline.com
A photonic integrated circuit may be coupled to an optical fiber and packaged. The optical
fiber may be supported by a fiber holder during a solder reflow process performed to mount …
fiber may be supported by a fiber holder during a solder reflow process performed to mount …