Wafer level thin film encapsulation for MEMS

C Gillot, JL Pornin, A Arnaud, E Lagoutte… - 2005 7th Electronic …, 2005 - ieeexplore.ieee.org
Because they have moving parts, or because they need to work in a specific atmosphere
(vacuum, inert gas,...), microelectromechanical systems (MEMS) are not compatible with …
被引用次数：44 相关文章

Wafer Level Thin Film Encapsulation for MEMS

C Gillot, E Lagoutte, PL Charvet… - 2005 Conference on …, 2005 - ieeexplore.ieee.org
Because they have moving parts, or because they need to work in a specific atmosphere
(vacuum, inert gas, etc.), micro-electromechanical systems (MEMS) are not compatible with …

Wafer Level Thin Film Encapsulation for MEMS

C Gillot, E Lagoutte, PL Charvet, F Souchon… - 2005 Conference on High … - infona.pl
Because they have moving parts, or because they need to work in a specific atmosphere
(vacuum, inert gas, etc.), micro-electromechanical systems (MEMS) are not compatible with …

Wafer level thin film encapsulation for MEMS

C Gillot, JL Pornin, A Arnaud, E Lagoutte, N Sillon… - 2005 7th Electronic … - infona.pl
Because they have moving parts, or because they need to work in a specific atmosphere
(vacuum, inert gas,...), microelectromechanical systems (MEMS) are not compatible with …