Asynchronously pulsed plasma for high aspect ratio nanoscale Si trench etch process

HJ Kim, GY Yeom - ACS Applied Nano Materials, 2023 - ACS Publications
The fabrication of high aspect ratio Si trenches has been becoming difficult due to the
decrease in critical dimension (CD) to deep nanoscale. Especially, aspect ratio dependent …
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[PDF][PDF] Asynchronously Pulsed Plasma for High Aspect Ratio Nanoscale Si Trench Etch Process

2023 - swb.skku.edu
The fabrication of high aspect ratio Si trenches has been becoming difficult due to the
decrease in critical dimension (CD) to deep nanoscale. Especially, aspect ratio dependent …

Asynchronously Pulsed Plasma for High Aspect Ratio Nanoscale Si Trench Etch Process

HJ Kim, GY Yeom - ACS APPLIED NANO MATERIALS, 2023 - scholarworks.bwise.kr
The fabrication of high aspect ratio Si trenches hasbeen becomingdifficult due to the
decrease in critical dimension (CD) to deep nanoscale. Especially, aspect ratio dependent …