Review of methods for the mitigation of plasma‐induced damage to low‐dielectric‐constant interlayer dielectrics used for semiconductor logic device interconnects

H Miyajima, K Ishikawa, M Sekine… - Plasma Processes and …, 2019 - Wiley Online Library
The developments in advanced interconnect technology for semiconductor logic devices for
the mitigation of plasma‐induced damage to low‐dielectric‐constant (low‐k) materials …
被引用次数：18 相关文章

[引用][C] Review of methods for the mitigation of plasma‐induced damage to low‐dielectric‐constant interlayer dielectrics used for semiconductor logic device …

H Miyajima, K Ishikawa, M Sekine, M Hori - Plasma Processes and …, 2019 - cir.nii.ac.jp
Review of methods for the mitigation of plasma‐induced damage to low‐dielectric‐constant
interlayer dielectrics used for semiconductor logic device interconnects | CiNii Research CiNii …

Review of methods for the mitigation of plasma‐induced damage to low‐dielectric‐constant interlayer dielectrics used for semiconductor logic device interconnects.

H Miyajima, K Ishikawa, M Sekine… - Plasma Processes & …, 2019 - search.ebscohost.com
The developments in advanced interconnect technology for semiconductor logic devices for
the mitigation of plasma‐induced damage to low‐dielectric‐constant (low‐k) materials …
[PDF] researchgate.net

[PDF][PDF] Review of methods for the mitigation of plasma-induced damage to low-dielectric-constant interlayer dielectrics used for semiconductor logic device …

H Miyajima, K Ishikawa, M Sekine… - Plasma Processes and …, 2019 - researchgate.net
The developments in advanced interconnect technology for semiconductor logic devices for
the mitigation of plasma-induced damage to low-dielectric-constant (low-k) materials …