BACKGROUND 0002 Optical signals may be used to communicate infor mation between
integrated circuits (ICs) such as ICs formed on different dies. Present techniques to optically …

BACKGROUND Optical signals may be used to communicate information between
integrated circuits (ICs) such as ICs formed on dif ferent dies. Present techniques to optically …

BACKGROUND 0002 Integrated circuits can be designed using different technologies, for
example complementary metal oxide semi conductor (CMOS) technology, glass technology …

BACKGROUND 0002 Advances in the design and manufacture of semi conductor devices
have led to shrinking sizes of semiconduc torpackages, wafers, and dies/chips. As …

Representative techniques and devices, including process steps may be employed to
mitigate undesired dishing in conductive interconnect structures and erosion of dielectric …

BACKGROUND Typically, in a semiconductor device, various electronic components (eg,
transistors, diodes, resistors, capacitors, and the like) are formed in device dies on a wafer …

Techniques and architectures for providing a reflective target area of an integrated circuit die
assembly. In an embodiment, a reflective bevel surface of a die allows an optical signal to be …

Representative implementations provide techniques for processing integrated circuit (IC)
dies and related devices, in preparation for stacking and bonding the devices. The disclosed …

BACKGROUND Packaging for dies that include, for example, at least one integrated circuit
(IC), is continually trending towards reduced package size with increased package density …

BACKGROUND 0003. The background description provided herein is for the purpose of
generally presenting the context of the disclo sure. Work of the presently named inventors, to …