用基于铅铟合金线的引线键合(WB) 工艺对单磁通量子(SFQ) 多芯片的超导互连方法进行了研究,
将铅含量75%, 铟含量25% 的铅铟合金线制备成WB 线材, 用超声楔形焊工艺成功实现SFQ …

This paper introduces the preparation of golden bumps on the single flux quantum (SFQ)
circuit chip by using the 20-μm-diameter golden wire and the flip-chip (FC) bonding of the …

We developed a multi-chip module (MCM) system of superconducting quantum bits with
single-flux quantum (SFQ) interface circuits. The MCM system consists of chips with …

We developed fabrication and bonding technology of superconductive bump for massive
quantum computing. A bonded test vehicle demonstrates supercurrent through 90 000 …

We have been developing a 10-kA/cm2 advanced Nb process in order to fabricate larger
scale and higher speed SFQ circuits with over 100k junctions. We have proposed a …

We report on development of a cryocooled system prototype for high-throughput single flux
quantum (SFQ) digital applications. The system was designed to have 32 I/O links with a …

We have developed fabrication technique of superconducting quantum interference device
(SQUID) magnetometers based on Nb/AlAlOx/Nb junctions directly on a glass epoxy …

We have developed a very flexible wiring technique of passive transmission lines (PTLs) in
single-flux-quantum (SFQ) circuits. For high flexibility, we introduced two types of wiring …

The joining process of individual BSCCO conductors is inevitable because the double
pancake coils need to be connected with each other. Since the resistance characteristics of …

Transmitting signals from one port to different ports at low temperature is necessary in
superconducting quantum test system. An on-chip superconducting quantum transponder …