With the increasing integration and miniaturization of electronic devices, heat dissipation
has become a major challenge. The traditional printed polymer circuit board can no longer …

With the development of microelectronic devices having miniaturized and integrated
electronic components, an efficient thermal management system with lightweight materials …

Recently, the use of thermal conductive polymeric composites is growing up, where the
polymers filled with the thermally conductive fillers effectively dissipate heat generated from …

At present, the rapid accumulation of heat and the heat dissipation of electronic equipment
and related components are important reasons that restrict the miniaturization, high …

Polymer matrix composites (PMCs) with high thermal conductivity (TC) play an important
role in improving the heat dissipation capacity of a new generation of electronic devices …

From prehistoric usage to modern high-tech computing, thermal conductive materials have
always been of profound importance. In our everyday lives, heat conduction is a common …

The high integration and high power devices cause serious local heat accumulation, which
will damage the reliability and service life of devices. Efficient heat dissipation has become …

While the past decades have witnessed the exponential increase of power and energy
densities in electronic devices, the efficient thermal management is critical for the …

Recently, the need for miniaturization and high integration have steered a strong technical
wave in developing (micro‐) electronic devices. However, excessive amounts of heat may …

The heat generated by a high-power device will seriously affect the operating efficiency and
service life of electronic devices, which greatly limits the development of the microelectronic …