This paper reviews the recent advances in reaction-ion etching (RIE) for application in high-
aspect-ratio microfabrication. High-aspect-ratio etching of materials used in micro-and …

The suitability of reactive ion etching for the fabrication of microelectro mechanical systems
(MEMS) has been evaluated by characterizing the change of lateral dimensions versus …

This article is a brief review of dry etching as applied to pattern transfer, primarily in silicon
technology. It focuses on concepts and topics for etching materials of interest in …

Deep reactive ion etching (DRIE) with the Bosch process is one of the key procedures used
to manufacture micron-sized structures for MEMS and microfluidic applications in silicon …

Different processes involving an inductively coupled plasma reactor are presented either for
deep reactive ion etching or for isotropic etching of silicon. On one hand, high aspect ratio …

Advanced deep reactive ion etching (ADRIE) is a new tool for the fabrication of bulk
micromachined devices. Different sensors and actuators which use ADRIE alone or …

This paper reports an advanced deep reactive ion etching (DRIE) process for realizing ultra-
deep (500-μm) and ultra-high aspect-ratio (UHAR) silicon structures (AR 40 for 1-mm …

In this article, we describe more than 100-μm-deep reactive ion etching (RIE) of silicon
carbide (SiC) in oxygen-added sulfur hexafluoride (SF 6) plasma. We used a homemade …

Dry etching of Si is critical in satisfying the demands of the micromachining industry. The
micro-electro-mechanical systems (MEMS) community requires etches capable of high …

This chapter discusses reactive ion etching (RIE) and deep RIE (DRIE) on wafers detailing
the various equipment and reactor requirements for different applications. The Bosch …