The demand for rapid advancement in AI, mobile and automotive markets is pushing the
boundaries of electronic packaging, including heterogeneous integration, high-power …

Product reliability, encompassing both manufacturing and operational aspects, is emerging
as a crucial aspect of design across iterative chip-package-system design cycles, especially …

Across academia, industry, and government there has been a resurgence of interest and
development of Artificial Intelligence (AI) as it emerges from a second winter. With advances …

The exponential growth of the electronics packaging industry has fueled the availability of a
variety of area array packages. The reliability of these packages, as characterized by their …

The quantity and variety of parameters involved in the failure evolutions in solder joints
under a thermo-mechanical process directs the reliability assessment of electronic devices …

We applied an artificial intelligence (AI) algorithm, the random forest (RF) model, using finite
element simulations to predict the reliability life of wafer-level packaging (WLP). Due to rapid …

Several design parameters affect the reliability of wafer-level type advanced packaging,
such as upper and lower pad sizes, solder volume, buffer layer thickness, and chip …

Design for reliability (DFR) in advanced technology nodes has become an increasingly
challenging task, which requires comprehensive support from aging-aware EDA tools and …

In the industry of manufacturing and design, one major constraint has been enhancing
operating performance using less time. As technology continues to advance, manufacturers …

For the current electronic package simulation evaluation process, the main steps include
material characterization, data treatment and finite element modeling (FEM). In the workflow …