JM Zahler, CG Ahn, S Zaghi,
HA Atwater, C Chu, P Iles - Thin Solid Films, 2002 - Elsevier
We have successfully used hydrophobic direct-wafer bonding, along with H-induced layer
splitting of Ge, to transfer 700-nm-thick, single-crystal Ge (100) films to Si (100) substrates …