Tin (Sn), as the matrix of most lead-free solders, plays a primary role in stress absorption
during the service of small-scale solder joints under cryogenic environment. The Sn grain …

The thermomechanical response of Sn-based solder interconnects with differently oriented
grains was investigated by electron backscattered diffraction technique under thermal …

Uniaxial compression experiments on micron-sized bicrystalline and single-crystalline
pillars in tin (Sn) using a flat punch nanoindenter tip, have enabled us to quantify the …

The inherent ductile-to-brittle transition (DBT) of body-centered tetragonal Sn at cryogenic
temperatures restricts the use of Sn-based solders in the interconnection of cryogenic …

Deformation phenomena of both pure tin and 63Sn37Pb eutectic solder under different
conditions were traced near the triple point of grain junctions by in situ observation. It was …

The elimination of lead from electronics due to its detrimental effects to environment and
health is pushing component manufacturers to consider lead free solder alloys as the …

The ductile-to-brittle-transition (DBT) of Sn occurring when the temperature decreases to a
critical temperature poses a restriction on the Sn-based solders in the cryogenic electronics …

In this paper, the grain orientation evolution of Pb-free solder joints during
thermomechanical fatigue (TMF) was characterized quantitatively using in-situ electron …

Solder joints provide mechanical support, and electrical and thermal interconnection among
various packaging levels in microelectronics assemblies. Reliability of electronic packages …

With the development of lead-free solders in the electronic packing industry, Sn–Ag–Cu
solders are one of the most promising lead-free alloys to be applied due to their outstanding …