MD simulations of low energy Clx+ ions interaction with ultrathin silicon layers for advanced etch processes

P Brichon, E Despiau-Pujo, O Joubert - Journal of Vacuum Science & …, 2014 - pubs.aip.org
Molecular dynamics simulations of low-energy (5–100 eV) Cl+ and Cl 2+ bombardment on
(100) Si surfaces are performed to investigate the impact of plasma dissociation and very …

Key plasma parameters for nanometric precision etching of Si films in chlorine discharges

P Brichon, E Despiau-Pujo, O Mourey… - Journal of Applied …, 2015 - pubs.aip.org
Ultrathin layered films in new transistors architectures (FinFET and fully depleted SOI)
require damage-free plasma etching techniques with unprecedented selectivity between …

Molecular dynamics simulations of silicon chloride ion incidence during Si etching in Cl-based plasmas

N Nakazaki, Y Takao, K Eriguchi… - Japanese Journal of …, 2014 - iopscience.iop.org
Classical molecular dynamics (MD) simulations have been performed for SiCl x+(x= 0–4)
ions incident on Si (100) surfaces, using an improved Stillinger–Weber (SW) potential form …

Molecular dynamics simulations of Si etching in Cl-and Br-based plasmas: Cl+ and Br+ ion incidence in the presence of Cl and Br neutrals

N Nakazaki, Y Takao, K Eriguchi, K Ono - Journal of applied physics, 2015 - pubs.aip.org
Classical molecular dynamics (MD) simulations have been performed for Cl+ and Br+ ions
incident on Si (100) surfaces with Cl and Br neutrals, respectively, to gain a better …

Molecular dynamics simulation of Si etching by off-normal Cl+ bombardment at high neutral-to-ion flux ratios

A Iwakawa, T Nagaoka, H Ohta… - Japanese journal of …, 2008 - iopscience.iop.org
Molecular dynamics simulations of Si etching using chlorine-based plasmas including both
high-energy (= 100 eV) Cl+ ions and low-energy neutral Cl radicals with a high neutral-to …

Molecular dynamics simulations of Cl+ etching on a Si (100) surface

F Gou, E Neyts, M Eckert, S Tinck… - Journal of Applied …, 2010 - pubs.aip.org
Molecular dynamics simulations using improved Tersoff–Brenner potential parameters were
performed to investigate Cl+ etching of a {2× 1} reconstructed Si (100) surface. Steady-state …

Role of etch products in polysilicon etching in a high-density chlorine discharge

C Lee, DB Graves, MA Lieberman - Plasma chemistry and plasma …, 1996 - Springer
For low-pressure, high-density plasma systems, etch products can play a significant role in
affecting plasma parameters such as species concentration and electron temperature. The …

Insitu pulsed laser‐induced thermal desorption studies of the silicon chloride surface layer during silicon etching in high density plasmas of Cl2 and Cl2/O2 …

CC Cheng, KV Guinn, VM Donnelly… - Journal of Vacuum …, 1994 - pubs.aip.org
We have used laser‐induced thermal desorption, combined with laser‐induced
fluorescence of SiCl (g) to study, in real time, the Si‐chloride (SiCl x (ads)) layer that is …

Molecular dynamics simulations of plasma-surface chemistry

ME Barone, DB Graves - Plasma Sources Science and …, 1996 - iopscience.iop.org
Molecular dynamics (MD) simulations were conducted of impact (normal incidence; 10, 25
and 50 eV) onto an initially pure Si surface until approximately steady state Cl coverages …

Molecular‐dynamics simulations of direct reactive ion etching of silicon by fluorine and chlorine

ME Barone, DB Graves - Journal of applied physics, 1995 - pubs.aip.org
We report results from molecular‐dynamics simulations of F+ and Cl+ impact of silicon
surfaces, at normal incidence and over a range of energies (10, 25, and 50 eV). The …