Embodiments herein describe disposing a waveguide adapter onto an SOI device after the
components on a silicon surface layer have been formed. That is, the waveguide adapter is …

A SOI device may include a waveguide adapter that couples light between an external light
source—eg, a fiber optic cable or laser—and a silicon waveguide on the silicon surface …

A SOI device may include a waveguide adapter that couples light between an external light
source—eg, a fiber optic cable or laser—and a silicon waveguide on the silicon surface …

The disclosed embodiments provide a system that implements an optical interface. The
system includes a semiconductor chip with a silicon layer, which includes a silicon …

BACKGROUND SOI optical devices may include an active surface layer that includes
waveguides, optical modulators, detectors, CMOS circuitry, metal leads for interfacing with …

Embodiments of the invention describe a silicon photonic interconnect, formed from an SOI
substrate, having a waveguide for receiving optical data from an integrated circuit. Said …

A photonic integrated circuit (PIC) is described. This PIC includes an inverse facet mirror on
a silicon optical waveguide for optical proximity coupling between two silicon-on-insulator …

An optical system includes a silicon (Si) substrate, a buried oxide (BOX) layer formed on the
substrate, a silicon nitride (SiN) layer formed above the BOX layer, and a SiN waveguide …

The present disclosure relates to an integrated chip having coupling elements that couple
electromagnetic radiation hav ing a frequency outside of the visible spectrum between a …

An optoelectronic coupling structure, a method of manufacture, and a method of operation
are described. The optical coupling structure includes a waveguide that is formed within a …