The auto-coupling effect between picosecond (ps) laser irradiation and electrochemical
dissolution is proposed to achieve localized and efficient dimpling of germanium (Ge), in …

The electrochemical machining (ECM) of germanium (Ge) wafer can be significantly
improved in terms of efficiency and localization by introducing laser irradiation. However …

The first-generation semiconductor materials represented by silicon (Si) and germanium
(Ge) still hold a dominant position in many fields, including micro-electromechanical systems …

The temperature field evolution and material removal process during picosecond (ps) laser
micro-grooving of single crystalline germanium (Ge) are explored by developing a 2D two …

A new micro patterning process without the need for a mask is proposed in this paper. It is a
combination of laser masking and electrochemical etching. In electrochemical etching …

The minimum and stability of material removal are critical determinants of the accuracy
limitations in precision engineering. This study explores electrochemically induced chemical …

Creating structures at the micro and nanoscales is a driving force for a diverse group of
technologies that have applications in biology, integrated electronic device fabrication, and …

Spark-assisted chemical engraving (SACE) is a flexible, simple and inexpensive method for
machining electrically non-conductive materials. SACE is particularly interesting because of …

This paper investigates the electrical discharge machining of gallium-doped p-type
germanium with a relaxation type pulse generator. A series of experiments were performed …

This paper proposes a method of selective electrochemical dissolution on the cylindrical
surfaces of stainless steel shafts. Selective electrochemical dissolution was achieved via …