The integrated circuits industry has been continuously producing microelectronic
components with ever higher integration level, packaging density, and power density, which …

Epoxy-based underfill encapsulant materials are used in advanced microelectronic
packaging to reduce thermal stresses on the solder joints and interconnections in integrated …

Thermal management plays a very vital role in the packaging of high performance electronic
devices. Effective heat dissipation is crucial to enhance the performance and reliability of the …

High-density integration and packaging technologies are highly desired to integrate more
functionality into a smaller form factor with improved performance, in which the polymer …

Polymeric composite based underfill materials, with well-controlled coefficient of thermal
expansion (CTE) are critical to flip-chip and other advanced high-density integrated circuit …

Owing to the trend of faster and denser circuit design, the dielectric properties of packaging
materials for semi‐conductors will have greater influence on performance and reliability …

In this study, epoxy (EP)/binary spherical alumina (S-Al 2 O 3) composites with a high
loading of 50 vol% were fabricated by incorporating different sizes of S-Al 2 O 3 into EP to …

Epoxy (EP) composites with comprehensive good processability, low coefficient of thermal
expansion (CTE), and high thermal conductivity, but electrical insulation properties are …

In this study, a thermal conductivity of 0.22 W· m− 1· K− 1 was obtained for pristine epoxy
(EP), and the impact of a hybrid filler composed of two-dimensional (2D) flake-like boron …

The thermal characteristics of thermally conductive underfill in flip-chip package was
studied. To enhance the thermal conductivity of underfill, the epoxy was mixed with thermally …