Embodiments provide for a photonic platform, comprising: a silicon component; a III-V
component; and a bonding layer contacting the silicon component on one side and the III-V …

The present disclosure provides for laser integration into photonic platforms in which a first
wafer, including a first substrate and a first insulator that includes a first plurality of dies that …

A silicon photonic platform includes a substrate supporting a buried oxide layer, an active
silicon layer deposited on the buried oxide layer, a first silicon nitride layer separated from …

The subject matter disclosed herein relates to a photonic module comprising: a silicon-on-
insulator (SOI) wafer; one or more photonic components on the SOI wafer; a plurality of …

In an example, a photonic system includes a Si PIC with a Si substrate, a SiO 2 box formed
on the Si substrate, a first layer, and a second layer. The first layer is formed above the SiO 2 …

In an example, a photonic system includes a Si PIC with a Si substrate, a SiO2 box formed
on the Si substrate, a first layer, and a second layer. The first layer is formed above the SiO2 …

Compact photonics platforms and methods of forming the same are provided. An example of
a compact photonics platform includes a layered structure having an active region along a …

Some embodiments relate to a photonic system comprising: a photonic substrate patterned
with a plurality of photonic modules including at least first and second photonic modules …

A photonic integrated circuit and a method of fabrication are provided which includes: a
substrate; a first optical waveguide disposed, at least in part, extending across the substrate …

A silicon photonic chip is provided comprising a top silicon device layer; an insulating layer
beneath the top silicon device layer, an intermediate silicon device layer beneath the …