This research reviews the application of computational mechanics on the properties of
nano/micro scaled thin films, in which the application of different computational methods is …

The ultra-miniaturization trend of the chips presents new challenges for non-destructive
peeling-off techniques. This study models the mini-LED chip-UV film adhesive system as a …

Interface design is an important topic in micro/nano electronic manufacturing. Interfaces of
dissimilar materials in micro/nano electronic manufacturing are prone to crack initiations …

Many important issues of structures, such as lattice mismatch, compatibility, orientation,
evolution, phase transition, surfaces, interfaces, defects, and domain engineering, have …

Thin films have become technologically important in recent years. The mechanical
properties of a thin film affect its mechanical behavior and may lead to problems such as …

For current semiconductor technology, interfacial crack in stacked thin films of Cu/low-k
damascene integration is a critical reliability issue that needs to be urgently resolved. In …

This research presents a simulation-based methodology to accurately predict interfacial
adhesion behaviors of heterostructures. Validation of the proposed approach is achieved …

Enhancing miniaturization and system integration of microelectronics components demands
growingly for novel solutions toward embedding active and passive components into …

The interfacial adhesion of thin films between Al metal and TiN barrier is one of the major
concerns dominating the mechanical reliability of semiconductor devices. The measured …

Interfacial delamination, due to the presence of dissimilar material systems, is one of the
primary concerns in electronic package design. Continuum models such as J-integral have …