The reliability of semiconductor materials with electrical and optical properties are
connected to their structures. The elastic strain field and tilt analysis of the crystal lattice …

The high-resolution X-ray diffraction techniques, such as double-crystal rocking and triple-
crystal diffraction, have become essential tools in the semiconductor materials and devices …

The understanding and management of strain is of fundamental importance in the design
and implementation of materials. The strain properties of nanocrystalline materials are …

Diffraction Analysis of the Microstructure of Materials provides an overview of diffraction
methods applied to the analysis of the microstructure of materials. Since crystallite size and …

A novel x‐ray technique and its application to semiconductor problems is described. The
technique is capable of recording large‐area transmission topographs of crystal slices as …

The availability of high brilliance third generation synchrotron sources together with
progress in achromatic focusing optics allows us to add submicron spatial resolution to the …

Two different methods of diffraction profile analysis are presented. In the first, the breadths
and the first few Fourier coefficients of diffraction profiles are analysed by modified …

X-ray line profile analysis is shown to be a powerful tool to characterize the microstructure of
nanocrystalline materials in terms of grain and subgrain size, dislocation structure and …

We present a method and an equipment for performing μm-resolved X-ray diffraction area
maps, and apply it to wafer defect analysis and industrial wafer quality inspection. The …

The rapid growth in the applications of electronic materials has created an increasing
demand for reliable techniques for examining and characterizing these materials. This book …