In this study, we investigate buckling and postbuckling of etching-induced wiggling in a
bilayer structure consisting of mask and masked layers. To show effects of explicit modeling …

In semiconductor devices, fine patterning can cause structural instability because of intrinsic
compressive stress. We studied one such instability phenomenon, out-of-plane wiggling of a …

To clarify whether pattern waviness due to line-edge-roughness enhances wiggling,
distortion of straight and wavy patterns was numerically analyzed by the three-dimensional …

Double-sided lapping is an precision machining method capable of obtaining high-precision
surface. However, during the lapping process of thin pure copper substrate, the workpiece …

An approach for evaluating residual stresses in thin films by critical buckling observation of
circular microstructures is proposed, by which the states of residual stresses can be …

Due to the increasing use of thin plates in lightweight welded structure, welding induced
buckling may occur in such thin plate welded structure. In this study, welding induced …

The automotive industry has been focusing on developing lighter vehicles to improve fuel
economy and crash safety. In order to meet these requirements, Three Dimensional Hot …

The strategy of tuning the applied compressive strain on the stiff film/intermediate layer/soft
substrate structure (named as the tri-layer structure), which can generate different kinds of …

Welding-induced buckling is a special type of welding distortion occurring during thin plate
butt welding and was investigated using both experimental and computational approaches …

Wafer warpage become more and more critical in the semiconductor industry. As is well
known, the wafer warpage is caused by the mismatch of thermal expansion coefficients …