Next generation communication and sensing require enabling technologies for miniaturized
and efficient heterogeneous systems while integrating technologies ranging from silicon to …

We present initial characterization of a novel, mono-lithically integrated multilayer mmW
phased array architecture that can be seamlessly incorporated with large-scale fabrication of …

In this brief, different on-chip passive structures designed in silicon-based technology are
overviewed, including resonator, filter, balun and coupler. These passive components act …

A broadband and miniaturized planar Yagi antenna-in-package (AiP) design for the fifth-
generation (5G) wireless communication is proposed. The monopole taper radiator is …

This paper presents a 2× 2 quad-core beamformer transmit/receive (TRX) chip with a peak
OP1dB of 17 dBm and an OP1dB> 15 dBm at 23-31.5 GHz, achieved using an asymmetrical …

Design of Antenna-in-Module (AiM) is presented to realize active and reconfigurable
antenna arrays for potential 5G applications at millimeter-wave (mmW) frequencies. Due to …

This paper introduces a modular, end-fire, dual-polarized ultra-wideband scalable array
(MEDUSA) realized with stereolithography (SLA) to achieve a novel connector-less phased …

This paper presents a deep integration strategy of multiple active devices within antenna for
simultaneous power amplification and radiation through a unified design and integration …

Wide bandwidth transmitter and receiver chips have been successfully developed by the
Davis Millimeter-Wave Research Center, including V-band (55-75 GHz) and W-band (75 …

A major challenge for low-cost silicon-based mm-wave wireless links, eg, for the 5G
communication, is to provide large transmitter (Tx) output power (P out) with high energy …