Automatic defect detection for glassivation passivation parts (GPP) wafer surface becomes
an extremely challenging task, due to the interference of random texture, disturbance of low …

Crack defects on the surface of glassivation passivation parts (GPP) wafers are a significant
factor leading to chip functional failure. Thus, efficient and stable surface defect detection is …

Abstract Glass Passivation Parts (GPP) wafer texture defects are one of the most important
factors affecting the accuracy of wafer defect detection. Template matching has local errors …

Glass wafer (GW) is used in a variety of integrated circuit (IC) packaging applications and as
substrates to provide better performance and cost-effectiveness. Glass wafer (GW) protects …

Highlights Cutting path Planning System for wafer images without Mark points in different
imaging states. Use the interlayer in the chip region as an auxiliary location to determine the …

Vision inspection has been widely used in the field of defect measurement as a noncontact,
nondestructive measurement technique. Conventional visual defect detection methods rely …

Due to the characteristics of small die size, large number of dies and large initial swing
angle of glassivation passivation parts (GPP) wafer, it becomes a more troublesome …

In this paper, we propose an unsupervised background reconstruction method to detect
defects on surfaces with unevenly distributed textures. An improved deep convolutional …

Efficient fabrication and high reliability of flexible integrated circuit package substrates
(FICS) urgently need effective defect detection methods. Based on the defect categories of …

Vision inspection has been extensively used in the field of defect measurement field as a
non-contact and nondestructive measurement technique. The conventional methods of …