The motivation of this thesis was to control crack steering into regions of engineered 3D-
nanopatterned structures with high fracture toughness and to determine the local critical …

An experimental approach to control the fracture behavior of 3D nanopatterned structures in
real time and to describe the microcrack propagation in solids quantitatively is presented …

Laboratory transmission X-ray microscopy with a spatial resolution of about 100 nm was
used to image 3D interconnect structures and failures in microchips during mechanical …

The mechanical robustness of microelectronic products is a serious reliability concern,
particularly for microchips and chipsets operated in harsh environments, for use cases that …

The combination of high-resolution X-ray imaging with in-situ mechanical testing, particularly
the application of a specially designed indenter manipulator in the full-field transmission X …

The method of microscopic imaging using X-rays and diffractive lenses was developed at
synchrotron radiation facilities and it was recently transferred to systems with laboratory X …

Chip-package interaction (CPI) and the related thermomechanical stress in microchips
increase the risk of failure in on-chip interconnect stacks, caused by delamination along …

Traditionally the driving force for crack growth is described in terms of global parameters
which, for continua, nevertheless reflect the local conditions at the crack‐tip. Mimicking …

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The characterization, control, and enhancement of the cracking resistance of freestanding
thin films and 2D materials are major concerns for the development of fail-safe flexible …