Because they have moving parts, or because they need to work in a specific atmosphere
(vacuum, inert gas,...), microelectromechanical systems (MEMS) are not compatible with …

The diversity and complexity of many micro electromechanical systems (MEMS), combined
with the mechanical nature of the devices involved, means that the handling, dicing and …

Packaging of microelectromechanical systems (MEMS) is a critical step in the transition from
product development to production. This paper presents a robust, hermetically-sealed …

The packaging of Micro-Electro-Mechanical Systems (MEMS) is a field of great importance
to anyone using or manufacturing sensors, consumer products, or military applications …

This paper reports a thin-film encapsulation technology for wafer level micro-electro-
mechanical systems (MEMS) package, using poly-benzo-oxazole (PBO) sacrificial material …

MEMS packaging poses novel constraints as compared to conventional IC packaging, and
accounts for up to 80% of the cost of the device. A new type of package is proposed …

Because they have moving parts, and they need to work in a specific atmosphere (vacuum,
inert gas...), micro-electromechanical system (MEMS) are not compatible with integrated …

This paper reviews several current MEMS based products and highlights the critical
packaging challenges for these devices. Several package configurations are shown, and …

For specific RF applications, where the use of MEMS is highly attractive, cost-effective
reliable packaging is one of the primary barriers to commercialization. Many RF MEMS …

Micro Electro Mechanical Systems (MEMS) packaging is expensive and product and
application specific. Single chip packages for IC's are only for some microsystems …