Thermal-constrained task allocation for interconnect energy reduction in 3-D homogeneous MPSoCs
3-D technology that stacks silicon dies with through silicon vias (TSVs) is a promising
solution to overcome the interconnect scaling problem in giga-scale integrated circuits (ICs) …
solution to overcome the interconnect scaling problem in giga-scale integrated circuits (ICs) …
PROMETHEUS: A proactive method for thermal management of heterogeneous MPSoCs
S Sharifi, D Krishnaswamy… - IEEE Transactions on …, 2013 - ieeexplore.ieee.org
In this paper, we propose PROMETHEUS, a framework for proactive temperature aware
scheduling of embedded workloads on single instruction set architecture heterogeneous …
scheduling of embedded workloads on single instruction set architecture heterogeneous …
Three-dimensional multiprocessor system-on-chip thermal optimization
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip
(MPSoC) integration density, performance, and power efficiency. However, the power …
(MPSoC) integration density, performance, and power efficiency. However, the power …
Thermal-aware task scheduling for energy minimization in heterogeneous real-time MPSoC systems
With the continuous scaling of CMOS devices, the increase in power density and system
integration level have not only resulted in huge energy consumption but also led to elevated …
integration level have not only resulted in huge energy consumption but also led to elevated …
Minimizing energy by thermal-aware task assignment and speed scaling in heterogeneous MPSoC systems
T Li, G Yu, J Song - Journal of Systems Architecture, 2018 - Elsevier
The ever-increasing power density has caused severe energy and thermal issues in real-
time embedded systems with limited energy capacity and cooling capability. Due to the …
time embedded systems with limited energy capacity and cooling capability. Due to the …
Minimizing temperature and energy of real-time applications with precedence constraints on heterogeneous MPSoC systems
The energy issue of real-time applications with precedence-constrained tasks on
heterogeneous systems has been studied recently. With the strikingly increasing power …
heterogeneous systems has been studied recently. With the strikingly increasing power …
Thermal-aware task scheduling for 3D multicore processors
A rising horizon in chip fabrication is the 3D integration technology. It stacks two or more
dies vertically with a dense, high-speed interface to increase the device density and reduce …
dies vertically with a dense, high-speed interface to increase the device density and reduce …
Thermal-aware task scheduling for peak temperature minimization under periodic constraint for 3D-MPSoCs
3D-MPSoC offer great performance and scalability benefits. However, due to strong vertical
thermal correlation and increased power density, thermal challenges in 3D-MPSoC are …
thermal correlation and increased power density, thermal challenges in 3D-MPSoC are …
Temperature-aware task allocation and scheduling for embedded multiprocessor systems-on-chip (MPSoC) design
Y Xie, WL Hung - Journal of VLSI signal processing systems for signal …, 2006 - Springer
Temperature affects not only the performance but also the power, reliability, and cost of the
embedded system. This paper proposes a temperature-aware task allocation and …
embedded system. This paper proposes a temperature-aware task allocation and …
Hybrid dynamic energy and thermal management in heterogeneous embedded multiprocessor SoCs
Heterogeneous multiprocessor system-on-chips (MPSoCs) which consist of cores with
various power and performance characteristics can customize their configuration to achieve …
various power and performance characteristics can customize their configuration to achieve …