This paper presents an in-depth overview of the present status and novel developments in
the field of plasma processing of low dielectric constant (low-k) materials developed for …

Plasma damage to low k dielectric materials was investigated from a mechanistic point of
view. Low k dielectric films were treated by Ar, O 2⁠, N 2⁠, N 2∕ H 2⁠, and H 2 plasmas in …

Over the last forty years, plasma supported processes have attracted ever-creasing interest,
and now, all modern semiconductor devices undergo at least one plasma-involved …

Plasma etching technologies such as reactive ion etching (RIE), isotropic etching, and
ashing/plasma cleaning are the currently used booster technologies for manufacturing all …

Low dielectric constant (low-k⁠) films have been widely used as insulating materials in ultra-
large-scale integrated circuits. Low-k films receive heavy damage during the plasma …

Integration of new low-κ interlayer dielectrics (ILD) with current damascene schemes is a
continuing issue in the microelectronics industry. During integration of the ILD, processing …

Pattern transfer by dry etching and plasma-enhanced chemical vapor de position are two of
the cornerstone techniques for modern integrated cir cuit fabrication. The success of these …

The introduction of ultra low-k materials in copper technology has been much slower than
anticipated in the ITRS Roadmap. The introduction of porosity in low-k materials has …

Low temperature plasma (LTP)-based synthesis of advanced materials has played a
transformational role in multiple industries, including the semiconductor industry, liquid …

An overview is presented of plasma-etching processes used in the fabrication of ULSI
(ultralarge-scale integrated) semiconductor circuits, with emphasis on work in our facilities …