Effect of interface structure and layer thickness on the mechanical properties and deformation behavior of Cu/Ag nanolaminates

Y Liang, A Luo, L Yang, J Zhao, L Wang… - Physica B: Condensed …, 2023 - Elsevier
We performed molecular dynamics (MD) simulations to study the effect of interface structure
and layer thickness on the mechanical properties of multilayered Cu/Ag composite with Cu …

Confined Layer Slip Process in Nanolaminated Ag and Two Ag/Cu Nanolaminates

M Fani, WR Jian, Y Su, S Xu - Materials, 2024 - mdpi.com
The exceptional strength of nanolaminates is attributed to the influence of their fine
stratification on the movement of dislocations. Through atomistic simulations, the impact of …

The relationship between deformation mechanisms and mechanical properties in nanocrystalline Cu/Ag-bilayer alloy

P Li, C Zhao, Y Jiang, F Cao, P Xiao, Y Song… - Journal of Alloys and …, 2024 - Elsevier
The nanocrystalline metallic bilayer structure can effectively enhance the strength of Cu
alloy while maintaining excellent electrical conductivity. Based on the microstructure …

[PDF][PDF] Impact Analysis of Microscopic Defect Types on the Macroscopic Crack Propagation in Sintered Silver Nanoparticles.

Z Zhang, B Wan, G Fu, Y Su, Z Wu… - … in Engineering & …, 2024 - cdn.techscience.cn
Sintered silver nanoparticles (AgNPs) are widely used in high-power electronics due to their
exceptional properties. However, the material reliability is significantly affected by various …

Impact of atomic void clusters on the tensile behavior and its features of silicon carbide polycrystal through molecular dynamics analysis

S Gowthaman - Silicon, 2023 - Springer
Atomic void or vacancy clusters plays an important role on the material behavior and its
features. In this study the impact of vacancy clusters on the tensile behavior of SiC …

[引用][C] Crack Propagation Analysis of Sintered Nanosilver with the Cross-Scale Simulation Method

Z Zhang, B Wan, G Fu, Y Su, Z Wu, X Wang, X Long - Available at SSRN 4328064