Abstract The Cu-1Ni-0.9 Sn-0.5 Ti-0.3 Cr alloy was prepared by vacuum induction melting.
The hot deformation experiments with the alloy were carried out using the Gleeble-1500 …

Abstract Cu-Ni-Si alloy is widely used in electronics industry due to its high electrical
conductivity and high strength. In this paper, the Cu-Ni-Co-Si-Cr alloy is prepared by ZG …

Abstract The Cu-1.0 Co-0.65 Si-0.1 Ti alloy was obtained by vacuum melting, and then the
hot deformation experiment was carried out by using the Gleeble-1500 simulator at 0.001 …

The Cu-1.7 Ni-1.4 Co-0.65 Si (wt%) alloy is hot compressed by a Gleeble-1500D machine
under a temperature range of 760 to 970° C and a strain rate range of 0.01 to 10 s− 1. The …

Abstract The Cu–Ni–Sn–Ti–Cr and Cu–Ni–Sn–Ti–Cr–Ce alloys were compressed at 500–
900° C with 0.001–10 s− 1 strain rates using the Gleeble 1500 deformation simulator. The …

The effects of Y addition on the microstructure evolution in the Cu-Sn-Ni-Zn-Ti alloys during
hot deformation were investigated. The hot deformation experiments were carried out using …

Hot deformation characteristics and dynamic recrystallization of Cu-3Ti-3Ni-0.5 Si alloy were
studied systematically in the range of 700–850° C and at the strain rate of 0.01–10 s− 1. The …

Hot deformation behavior of Cu-9Ni-6Sn-0.04 Cr alloy has been investigated by isothermal
compression tests in the temperature range of 750∼ 900℃ and the strain rate range of …

The hot deformation behavior of Cu–Sn–Ti–(Cr) alloys was studied using Gleeble-1500D
thermo-mechanical simulator ranging from 550 to 950° C, and the strain rate was 0.001–10 …

The hot compression tests of Cu-1.56 Ni-0.65 Si-1.12 Co-0.05 Zr alloy were carried out by a
Gleeble-1500 numerical control dynamic-mechanical simulation testing machine under the …