Strengthening mechanism of ultra-high strength Cu–20Ag alloy wire induced by cumulative strain
This study deals with the evolution of strength and microstructure in Cu–20Ag alloy during
wire drawing from an initial diameter of 7.84 mm–0.02 mm. The final wire had a strength of …
wire drawing from an initial diameter of 7.84 mm–0.02 mm. The final wire had a strength of …
Microstructural evolution and properties of Cu–20 wt% Ag alloy wire by multi-pass continuous drawing
C Cheng, K Song, X Mi, B Wu, Z Xiao, H Xie… - Nanotechnology …, 2020 - degruyter.com
Abstract The Cu–20 wt% Ag alloy wire rod was prepared using three-chamber vacuum cold
mold vertical continuous up-casting followed by multi-pass continuous drawing. The …
mold vertical continuous up-casting followed by multi-pass continuous drawing. The …
Microstructure evolution of high-strength and ultra-high-conductivity microfilament wire prepared by continuous deformation of single-crystal copper
The φ 16 mm single-crystal copper rod billet was prepared by the heated mold horizontal
continuous casting process. After cold drawing+ 600° C× 5 s annealing to φ 1 mm, the …
continuous casting process. After cold drawing+ 600° C× 5 s annealing to φ 1 mm, the …
Yield stress influenced by the ratio of wire diameter to grain size–a competition between the effects of specimen microstructure and dimension in micro-sized …
B Yang, C Motz, M Rester, G Dehm - Philosophical Magazine, 2012 - Taylor & Francis
Polycrystalline copper wires with diameters of 25, 30 and 50 µm were annealed at
temperatures between 200° C and 900° C, resulting in different microstructures with ratios of …
temperatures between 200° C and 900° C, resulting in different microstructures with ratios of …
Development and microstructure of Cu–Zr alloy wire with ultimate tensile strength of 2.2 GPa
N Muramatsu, H Kimura, A Inoue - Materials Transactions, 2012 - jstage.jst.go.jp
Recently electronic devices have undergone extreme miniaturization with the simultaneous
addition of even greater levels of functionality. Further development along this path requires …
addition of even greater levels of functionality. Further development along this path requires …
Effect of wire-drawing process conditions on secondary recrystallization behavior during annealing in high-purity copper wires
H Park, SH Kim, WJ Lee, JW Ha, SJ Kim… - Metals and Materials …, 2021 - Springer
The relationship between the process condition of wire-drawing and the microstructural
evolution during the subsequent annealing was investigated for the production of high-purity …
evolution during the subsequent annealing was investigated for the production of high-purity …
Change in microstructures and mechanical properties during deep wire drawing of copper
K Hanazaki, N Shigeiri, N Tsuji - Materials Science and Engineering: A, 2010 - Elsevier
Evolution of microstructure and change in mechanical properties of a pure copper wire
deformed to equivalent strain of 6.9 by deep wire-drawing (WD) process were investigated …
deformed to equivalent strain of 6.9 by deep wire-drawing (WD) process were investigated …
Excellent strength and electrical conductivity achieved by optimizing the dual-phase structure in Cu–Fe wires
Cu–Fe alloy wire with high strength, moderate electrical conductivity and low cost, has a
promising application prospect in the electrical industry. In this study, high performance …
promising application prospect in the electrical industry. In this study, high performance …
Effect of cold drawing strain on the microstructure, mechanical properties and electrical conductivity of low-oxygen copper wires
F Yang, L Dong, L Cai, L Wang, Z Xie, F Fang - Materials Science and …, 2021 - Elsevier
The effects of cold drawing process on the microstructure, mechanical properties and
electrical conductivity of low-oxygen copper wires were studied. The results show that at low …
electrical conductivity of low-oxygen copper wires were studied. The results show that at low …
The effect of stacking fault energy on the microstructural development during room temperature wire drawing in Cu, Al and their dilute alloys
SK Varma, V Caballero, J Ponce, A De La Cruz… - Journal of materials …, 1996 - Springer
The effect of stacking fault energy (SFE) on the evolution of microstructures during wire
drawing at room temperature has been studied in pure aluminium, pure copper and Cu …
drawing at room temperature has been studied in pure aluminium, pure copper and Cu …