F Roozeboom, B Kniknie, R Knaapen… - 2012 4th Electronic …, 2012 - ieeexplore.ieee.org
Conventional Deep Reactive Ion Etching (DRIE) is a plasma etch process with alternating
half-cycles of 1) Si-etching with SF 6 to form gaseous SiF x etch products, and 2) passivation …