[HTML][HTML] Combinatorial survey of fluorinated plasma etching in the silicon-oxygen-carbon-nitrogen-hydrogen system

S Dhungana, BJ Nordell, AN Caruso… - Journal of Vacuum …, 2016 - pubs.aip.org
New multipass optical lithography patterning methods needed to print features for future< 10
nm technologies will demand an increasingly complex combination of hardmasks …

Selective dry etching of TiN nanostructures over SiO2 nanotrenches using a Cl2/Ar/N2 inductively coupled plasma

B Lee Sang, MJ Gour, M Darnon, S Ecoffey… - Journal of Vacuum …, 2016 - pubs.aip.org
An inductively coupled plasma etch process for the fabrication of TiN nanostructures over
nanotopography is presented. Using a Cl 2/Ar/N 2 plasma, a selectivity of 50 is achieved …

Characterization of Patterned Porous Low-k Dielectrics: Surface Sealing and Residue Removal by Wet Processing/Cleaning

QT Le, E Kesters, S Decoster, BT Chan… - ECS Journal of Solid …, 2016 - iopscience.iop.org
The results described in this paper first demonstrate key differences between a plasma-
exposed blanket porous dielectric sample and a patterned structure in terms of surface …

Mechanical Properties of Low- and High-k Dielectric Thin Films by Brillouin Light Scattering

J Zizka - 2016 - rave.ohiolink.edu
Brillouin light scattering (BLS) is a powerful tool for studying acoustics and determining
mechanical properties for an array of material types of varying structures. Specific to this …

[引用][C] Characterization of Post-plasma Etch Residues and Plasma Induced Damage Evaluation on Patterned Porous Low-k Dielectrics Using MIR-IR Spectroscopy

S Rimal - 2016 - University of North Texas