Photonic chip with an evanescent coupling interface
V Patel, M Webster, R Tummidi, M Nadeau - US Patent 9,933,566, 2018 - Google Patents
Embodiments herein describe a photonic chip which includes a coupling interface for
evanescently coupling the chip to a waveguide on an external substrate. In one …
evanescently coupling the chip to a waveguide on an external substrate. In one …
Low cost integration of optical components in planar lightwave circuits
PLD Chang, JH Tseng - US Patent 9,939,578, 2018 - Google Patents
Planar lightwave circuits with a polymer coupling waveguide optically coupling a planar
waveguide over a first region of a substrate to an optical component, such as a laser, affixed …
waveguide over a first region of a substrate to an optical component, such as a laser, affixed …
Optical fiber structure, optical communication apparatus and manufacturing process for manufacturing the same
WL Wang, YM Chin, MJ Lu, J Zhang - US Patent 10,025,033, 2018 - Google Patents
The present disclosure relates to an optical fiber structure, an optical communication
apparatus and a manufacturing process for manufacturing the same. The optical fiber …
apparatus and a manufacturing process for manufacturing the same. The optical fiber …
Integration of bonded optoelectronics, photonics waveguide and VLSI SOI
An optoelectronic device includes an integrated circuit including electronic devices formed
on a front side of a semiconductor substrate. A barrier layer is formed on a back side of the …
on a front side of a semiconductor substrate. A barrier layer is formed on a back side of the …
Integration of bonded optoelectronics, photonics waveguide and VLSI SOI
An optoelectronic device includes an integrated circuit including electronic devices formed
on a front side of a semiconductor substrate. A barrier layer is formed on a back side of the …
on a front side of a semiconductor substrate. A barrier layer is formed on a back side of the …
Integration of bonded optoelectronics, photonics waveguide and VLSI SOI
An optoelectronic device includes an integrated circuit including electronic devices formed
on a front side of a semiconductor substrate. A barrier layer is formed on a back side of the …
on a front side of a semiconductor substrate. A barrier layer is formed on a back side of the …
Integration of bonded optoelectronics, photonics waveguide and VLSI SOI
An optoelectronic device includes an integrated circuit including electronic devices formed
on a front side of a semiconductor substrate. A barrier layer is formed on a back side of the …
on a front side of a semiconductor substrate. A barrier layer is formed on a back side of the …