[HTML][HTML] Uprooting defects to enable high-performance III–V optoelectronic devices on silicon

YA Bioud, A Boucherif, M Myronov, A Soltani… - Nature …, 2019 - nature.com
The monolithic integration of III-V compound semiconductor devices with silicon presents
physical and technological challenges, linked to the creation of defects during the deposition …

Evaluation of floor-wise pollution status and deposition behavior of potentially toxic elements and nanoparticles in air conditioner dust during urbanistic development

MU Ali, G Liu, B Yousaf, H Ullah, S Irshad… - Journal of hazardous …, 2019 - Elsevier
The study was undertaken to investigate deposition behaviors of various size-segregated
particles and indoor air quality using dust accumulated on the air conditioner filter acting as …

Enhanced removal of arsenic and chromium contaminants from drinking water by electrodeposition technique using graphene composites

LE Verduzco, J Oliva, AI Oliva, E Macias… - Materials Chemistry and …, 2019 - Elsevier
This work reports the use of compacted graphene composites for the removal of As and Cr
heavy metal ions from contaminated water by electrodeposition. The removal of the metal …

Anodic imprint lithography: Direct imprinting of single crystalline GaAs with anodic stamp

K Kim, B Ki, K Choi, J Oh - ACS nano, 2019 - ACS Publications
Anodic imprint lithography patterns the GaAs substrate electrochemically by applying a
voltage through a predefined anodic stamp. This newly devised technique performs anodic …

Oxide crystals on the surface of porous indium phosphide

YO Suchikova, IT Bogdanov… - Archives of Materials …, 2019 - archivesmse.org
Purpose: f this paper is to is to establish the patterns of oxide formation on the surface of
indium phosphide during electrochemical etching of mono-InP. Design/methodology …

A porous Ge/Si interface layer for defect-free III-V multi-junction solar cells on silicon

YA Bioud, MN Beattie, A Boucherif… - Physics, Simulation …, 2019 - spiedigitallibrary.org
III-V solar cell cost reduction and direct III-V/Si integration can both be realized by depositing
a thin layer of high-quality Ge on relatively low-cost Si substrates. However, direct epitaxial …